Mitsubishi Electric Corp. has announced that its Power Device Works' Fukuyama Factory has commenced large-scale production of power semiconductor chips utilizing 12-inch silicon (Si) wafers for semiconductor module assembly, effective immediately.
These advanced Si power-semiconductor modules are set to be initially deployed in consumer products.
The company aims to support the green transformation (GX) initiative by ensuring a stable and prompt supply of semiconductor chips, addressing the increasing demand for energy-efficient power electronics across various applications.
As part of Mitsubishi Electric's medium-term strategy, the Fukuyama Factory will be instrumental in doubling the wafer processing capacity for Si power semiconductors by fiscal 2026 compared to its capacity five years prior.
